IEC 61189-2:1997/AMD1:2000

January 2000

International standard Cancelled

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Main informations

Collections

International IEC standards

Publication date

January 2000

Number of pages

37 p.

Reference

IEC 61189-2:1997/AMD1:2000

ICS Codes

31.180 Printed circuits and boards

Print number

Standard replaced by (1)

IEC 61189-2:2006

May 2006

International standard Current

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

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