IEC 60249-1:1982/AMD4:1993

IEC 60249-1:1982/AMD4:1993

May 1993
International standard Cancelled

Amendment 4 - Base materials for printed circuits. Part 1: Test methods

Contains Amendments Nos. 1, 2 and 3.

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Main informations

Collections

International IEC standards

Publication date

May 1993

Number of pages

17 p.

Reference

IEC 60249-1:1982/AMD4:1993

Print number

2
Sumary
Amendment 4 - Base materials for printed circuits. Part 1: Test methods

Contains Amendments Nos. 1, 2 and 3.
Standard replaced by (1)
IEC 61189-2:1997
April 1997
International standard Cancelled
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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