IEC 60249-1:1982

IEC 60249-1:1982

January 1982
International standard Cancelled

Base materials for printed circuits. Part 1: Test methods

Describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in the field of printed circuits irrespective of the nature of the insulating base material.

Main informations

Collections

International IEC standards

Publication date

January 1982

Number of pages

81 p.

Reference

IEC 60249-1:1982

ICS Codes

31.180   Printed circuits and boards

Print number

1
Sumary
Base materials for printed circuits. Part 1: Test methods

Describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in the field of printed circuits irrespective of the nature of the insulating base material.
Replaced standards (1)
IEC 60249-1:1968
January 1968
International standard Cancelled
Metal-clad base materials for printed circuits - Part 1 : Test methods

Describes methods for testing electrical, mechanical and other properties of base materials in sheet or roll form for application in the field of printed circuits irrespective of the nature of the insulating base material.

Standard replaced by (1)
IEC 61189-2:1997
April 1997
International standard Cancelled
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

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