IEC 60352-5:2008

IEC 60352-5:2008

January 2008
International standard Cancelled

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.

Main informations

Collections

International IEC standards

Publication date

January 2008

Number of pages

72 p.

Reference

IEC 60352-5:2008

Print number

3 - 26/02/2008
Sumary
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
Replaced standards (1)
International standard Cancelled
Amendment 1 - Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

Standard replaced by (1)
IEC 60352-5:2012
February 2012
International standard Cancelled
Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance

IEC 60352-5:2012 is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. The press-in connection consists of a termination having a suitable press-in zone which is inserted into a plated-through hole of a double-sided or multilayer printed board. Information on materials and data from industrial experience is included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of press-in connections under mechanical, electrical and atmospheric conditions as specified by the manufacturer of the press-in termination and to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture. This fourth edition cancels and replaces the third edition published in 2008. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - enhancement of Annex A and further application remarks are added; - editorial changes throughout the standard to prevent the document from being misunderstood as specification for establishing press-in connection in total; - deletion of all tables with hole dimensions. Historically the hole dimensions were constrained because of the dimensions of the wire wrap and clip connections posts. Since these connection technologies are no longer commonly used, the design requirements are no longer practical; - inclusion of additional figures and one table in 4.4.4 to define tolerance ranges for holes in test-boards and to illustrate them; - inclusion of a requirement for the thickness of the test-board in 4.4. The contents of the corrigendum of September 2014 have been included in this copy.

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