IEC 60384-10:1989
Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors
Applicable to fixed unencapsulated multilayer chip capacitors ofceramic dielectric, Class 1 and Class 2, with a rated voltagenormally not exceeding 200 V, for use in electronic equipment. Thesecapacitors have metallized connecting pads or soldering strips andare intended to be mounted directly on to substrates for hybridcircuits or on to printed boards.
Applicable to fixed unencapsulated multilayer chip capacitors of ceramic dielectric, Class 1 and Class 2, with a rated voltage normally not exceeding 200 V, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. The contents of the corrigendum of September 2004 have been included in this copy.
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. The contents of the corrigendum of September 2004 have been included in this copy.
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