IEC 60384-22:2004

IEC 60384-22:2004

June 2004
International standard Cancelled

Fixed capacitors for use in electronic equipment - Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2

applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.The contents of the corrigendum of September 2004 have been includedin this copy.

Main informations

Collections

International IEC standards

Publication date

June 2004

Number of pages

39 p.

Reference

IEC 60384-22:2004

Print number

1
Sumary
Fixed capacitors for use in electronic equipment - Part 22: Sectional specification: Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2

applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. The contents of the corrigendum of September 2004 have been included in this copy.
Replaced standards (4)
International standard Cancelled
Amendment 1 - Fixed capacitors for use in electronic equipment. Part 10: Blank detail specification: Fixed multilayer ceramic chip capacitors. Assessment level E

IEC 60384-10-1:1989
April 1989
International standard Cancelled
Fixed capacitors for use in electronic equipment. Part 10: Blank detail specification: Fixed multilayer ceramic chip capacitors. Assessment level E

Supplementary document to the sectional specification which contains requirements for style and layout and minimum content of detail specifications.

International standard Cancelled
Amendment 1 - Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors

IEC 60384-10:1989
April 1989
International standard Cancelled
Fixed capacitors for use in electronic equipment. Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors

Applicable to fixed unencapsulated multilayer chip capacitors of ceramic dielectric, Class 1 and Class 2, with a rated voltage normally not exceeding 200 V, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.

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Standard replaced by (1)
IEC 60384-22:2011
December 2011
International standard Cancelled
Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2

IEC 60384-22:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. The object of this standard is to prescribe preferred ratings and characteristics and to select from IEC 60384-1 the appropriate quality assessment procedures, tests and measuring methods and to give general performance requirements for this type of capacitor. Test severities and requirements prescribed in detail specifications referring to this sectional specification should be of equal or higher performance level, lower performance levels are not permitted. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition. - The measuring frequency of 1 MHz has been reduced to 1 kHz for 100 pF, see 4.5.1 Capacitance. - The test voltage of 1,2 UR at UR greater or equal to 1 000 V has been added in 4.5.4 Voltage proof. - Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. - Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. - A selection of the test conditions according to marketing needs has been stated in 4.13 Damp heat, steady state. - The dimensions of 0402 M in Annex A have been added. - The temperature characteristics code of capacitance for the reference temperature of 25 °C has been added, see Annex C.

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