IEC 60749-11:2002
Collections
International IEC standards
Publication date
April 2002
Number of pages
13 p.
Reference
IEC 60749-11:2002
IEC 60749-11:2002
April 2002
International standard
Current
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.
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Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.
Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.
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Replaced standards
(1)
IEC PAS 62185:2000
August 2000
Publicly available specification
Cancelled
Thermal shock test method
This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
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