IEC PAS 62185:2000

IEC PAS 62185:2000

August 2000
Publicly available specification Cancelled

Thermal shock test method

This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.

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International IEC standards

Publication date

August 2000

Number of pages

7 p.

Reference

IEC PAS 62185:2000

Print number

1
Sumary
Thermal shock test method

This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
Standard replaced by (1)
IEC 60749-11:2002
April 2002
International standard Current
Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

Defines the rapid change of temperature test method and the two-fluid-bath method. This test method may also be used, employing fewer cycles, to test the effect of immersion in heated liquids that are used for the purpose of cleaning devices. This test is applicable to all semiconductor devices. It is considered destructive unless otherwise detailed in the relevant specification. The contents of the corrigenda of January 2003 and August 2003 have been included in this copy.

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