IEC 60749-25:2003
IEC 60749-25:2003

IEC 60749-25:2003

July 2003
International standard Current

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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Main informations

Collections

International IEC standards

Publication date

July 2003

Number of pages

25 p.

Reference

IEC 60749-25:2003

ICS Codes

31.080.01   Semiconductor devices in general
Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Replaced standards (1)
IEC PAS 62178:2000
IEC PAS 62178:2000
August 2000
Publicly available specification Cancelled
Temperature cycling

This test is conducted to determine the resistance of a part to extremes of high- and low-temperatures and to the effect of alternate exposures to these extremes.

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