IEC 60749-25:2003

IEC 60749-25:2003

July 2003
International standard Current

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

See more
Main informations

Collections

International IEC standards

Publication date

July 2003

Number of pages

25 p.

Reference

IEC 60749-25:2003
Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
Replaced standards (1)
IEC PAS 62178:2000
August 2000
Publicly available specification Cancelled
Temperature cycling

This test is conducted to determine the resistance of a part to extremes of high- and low-temperatures and to the effect of alternate exposures to these extremes.

Need to identify, monitor and decipher standards?

COBAZ is the simple and effective solution to meet the normative needs related to your activity, in France and abroad.

Available by subscription, CObaz is THE modular solution to compose according to your needs today and tomorrow. Quickly discover CObaz!

Request your free, no-obligation live demo

I discover COBAZ