IEC PAS 62178:2000
IEC PAS 62178:2000

IEC PAS 62178:2000

August 2000
Publicly available specification Cancelled

Temperature cycling

This test is conducted to determine the resistance of a part to extremes of high- and low-temperatures and to the effect of alternate exposures to these extremes.

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International IEC standards

Publication date

August 2000

Number of pages

6 p.

Reference

IEC PAS 62178:2000

Print number

1
Sumary
Temperature cycling

This test is conducted to determine the resistance of a part to extremes of high- and low-temperatures and to the effect of alternate exposures to these extremes.
Standard replaced by (1)
IEC 60749-25:2003
IEC 60749-25:2003
July 2003
International standard Current
Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

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