IEC 60749-3:2002/COR1:2003

IEC 60749-3:2002/COR1:2003

August 2003
International standard Cancelled

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Modification of the validity date: now put at 2007.

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Main informations

Collections

International IEC standards

Publication date

August 2003

Number of pages

0 p.

Reference

IEC 60749-3:2002/COR1:2003

Print number

1 - 13/06/2005
Sumary
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

Modification of the validity date: now put at 2007.
Standard replaced by (1)
IEC 60749-3:2017
March 2017
International standard Current
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.

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