IEC 60749-3:2017
Collections
International IEC standards
Publication date
March 2017
Number of pages
11 p.
Reference
IEC 60749-3:2017
Print number
2
IEC 60749-3:2017
March 2017
International standard
Current
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.This edition includes the following significant technical changes with respect to the previous edition:a) reference to the need for ESD protection;b) inclusion of information on the phenomenon of tin whiskers;c) inclusion of an optional report form/checklist.
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Sumary
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance.
This edition includes the following significant technical changes with respect to the previous edition:
a) reference to the need for ESD protection;
b) inclusion of information on the phenomenon of tin whiskers;
c) inclusion of an optional report form/checklist.
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Replaced standards
(2)
IEC 60749-3:2002
April 2002
International standard
Cancelled
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection
Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The contents of the corrigendum of August 2003 have been included in this copy.
IEC 60749-3:2002/COR1:2003
August 2003
International standard
Cancelled
Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
Modification of the validity date: now put at 2007.
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