Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.The contents of the corrigendum of August 2003 have been included in this copy.
IEC 60749-3:2017 is to verify that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types. The test is useful for qualification, process monitor, or lot acceptance. This edition includes the following significant technical changes with respect to the previous edition: a) reference to the need for ESD protection; b) inclusion of information on the phenomenon of tin whiskers; c) inclusion of an optional report form/checklist.
COBAZ is the simple and effective solution to meet the normative needs related to your activity, in France and abroad.
Available by subscription, CObaz is THE modular solution to compose according to your needs today and tomorrow. Quickly discover CObaz!
Request your free, no-obligation live demo
I discover COBAZ