IEC 60749-5:2017

April 2017

International standard Cancelled

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.This edition includes the following significant technical changes with respect to the previous edition:a) correction of an error in an equation;b) inclusion of notes for guidance;c) clarification of the applicability of test conditions.

Main informations

Collections

International IEC standards

Publication date

April 2017

Number of pages

9 p.

Reference

IEC 60749-5:2017

ICS Codes

31.080.01 Semiconductor devices in general

Print number

Sumary

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.

Replaced standards (1)

IEC 60749-5:2003

January 2003

International standard Cancelled

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

Provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.

Standard replaced by (1)

IEC 60749-5:2023

December 2023

International standard Current

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to ?virtual junction? with ?die?.

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