IEC 60863:1986
Presentation of reliability, maintainability and availability predictions
Defines the items that should be considered for the presentation of information regarding predictions of quantitative characteristics of reliability, maintainability and availability of systems and equipment, including hardware, software and human elements. Provides the writer of a prediction report with a complete listing of all items to be considered in making a proper and full presentation of prediction information. This recommended way of presentation is intended to facilitate comparisons between projects or reports.
Defines the items that should be considered for the presentation of information regarding predictions of quantitative characteristics of reliability, maintainability and availability of systems and equipment, including hardware, software and human elements. Provides the writer of a prediction report with a complete listing of all items to be considered in making a proper and full presentation of prediction information. This recommended way of presentation is intended to facilitate comparisons between projects or reports.
Describes the information needed for characterizing reliability of a component, and also the detailed requirements for reporting reliability data. Gives guidance to component users as to how they should specify their reliability requirements to component manufacturers. The data, derived from laboratory tests, should enable circuit and equipment designers to evaluate the reliability of circuits and systems.
Gives guidance on the use of failure rate data for the reliability prediction of components in electronic equipment. Reference conditions for failure rate data are specified, so that data from different sources can be compared. The reference conditions adopted are typical of the majority of applications of components in equipment (e.g. telecommunication use, data processing). In this standard it is assumed that the failure rate used under reference conditions is specific to the component i.e. it includes the effect of complexity, technology of the casing, dependence on manufacturers and the manufacturing process, etc.
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