IEC 61760-1:1998

IEC 61760-1:1998

August 1998
International standard Cancelled

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Applies to all electronic components covered by the IEC system which require an assessment with respect to their application to surface mounting. Gives a reference set of process conditions and related test conditions to be used when complying component specifications.

Main informations

Collections

International IEC standards

Publication date

August 1998

Number of pages

53 p.

Reference

IEC 61760-1:1998

Print number

1
Sumary
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Applies to all electronic components covered by the IEC system which require an assessment with respect to their application to surface mounting. Gives a reference set of process conditions and related test conditions to be used when complying component specifications.
Standard replaced by (1)
IEC 61760-1:2006
April 2006
International standard Cancelled
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern: - requirements related to lead-free soldering; - extension of the scope to include also components mounted by gluing; - direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat; - classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

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