IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:- requirements related to lead-free soldering;- extension of the scope to include also components mounted by gluing;- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Applies to all electronic components covered by the IEC system which require an assessment with respect to their application to surface mounting. Gives a reference set of process conditions and related test conditions to be used when complying component specifications.
IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component specifications. The objective of this document is to ensure that a wide variety of SMDs can be subjected to the same placement, mounting and subsequent processes (e.g. cleaning, inspection) during assembly. This document defines tests and requirements that need to be part of any SMD component's general, sectional or detail specification. In addition, this document provides component users and manufacturers with a reference set of typical process conditions used in surface mounting technology. Some of the requirements for component specifications in this document are also applicable to components with leads intended for mounting on a circuit board. Cases for which this is appropriate are indicated in the relevant subclauses. This edition includes the following significant technical changes with respect to the previous edition: a) inclusion of additional mounting methods: conductive glue bonding, sintering and solderless interconnection.
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