IEC 60326-6:1980/AMD1:1983

IEC 60326-6:1980/AMD1:1983

December 1983
International standard Cancelled

Amendment 1 - Printed boards. Part 6: Specification for multilayer printed boards.

Amendment to Clause 8: Test pattern - text boards. Gives a new multiple arrangement of the composite test pattern on the board as well as new specimen designs.

Main informations

Collections

International IEC standards

Publication date

December 1983

Number of pages

16 p.

Reference

IEC 60326-6:1980/AMD1:1983

Print number

1
Sumary
Amendment 1 - Printed boards. Part 6: Specification for multilayer printed boards.

Amendment to Clause 8: Test pattern - text boards. Gives a new multiple arrangement of the composite test pattern on the board as well as new specimen designs.
Standard replaced by (2)
IEC 62326-4:1996
December 1996
International standard Current
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.

IEC 62326-4-1:1996
December 1996
International standard Current
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.

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