IEC 62326-4:1996
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
Applicable to rigid multilayer printed boards irrespective of theirmethod of manufacture. It is the basis on which agreements betweenmanufacturer and user are to be made.Provides additional information necessary to supplement therequirements of the Generic Specification, IEC 62326-1, for theprinted boards intended to be accepted under the IECQ system.Establishes uniform requirements, specifies the characteristics tobe assessed and the test methods to be used for qualityconformance.
Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.
Includes solder resist requirements.
Amendment to Clause 8: Test pattern - text boards. Gives a new multiple arrangement of the composite test pattern on the board as well as new specimen designs.
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreements between purchaser and vendor can be made.
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