IEC 60326-6:1980
Collections
International IEC standards
Publication date
January 1980
Number of pages
34 p.
Reference
IEC 60326-6:1980
Print number
1
IEC 60326-6:1980
January 1980
International standard
Cancelled
Printed boards. Part 6: Specification for multilayer printed boards.
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreements between purchaser and vendor can be made.
Main informations
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Sumary
Printed boards. Part 6: Specification for multilayer printed boards.
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreements between purchaser and vendor can be made.
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreements between purchaser and vendor can be made.
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Voir moins
Standard replaced by
(2)
IEC 62326-4:1996
December 1996
International standard
Current
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
Applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made. Provides additional information necessary to supplement the requirements of the Generic Specification, IEC 62326-1, for the printed boards intended to be accepted under the IECQ system. Establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance.
IEC 62326-4-1:1996
December 1996
International standard
Current
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.
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