Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.
Amendment to Clause 8: Test pattern - text boards. Gives a new multiple arrangement of the composite test pattern on the board as well as new specimen designs.
Includes solder resist requirements.
Defines the characteristics to be assessed, the test methods to be used and establishes uniform requirements for judging properties and dimensions of multilayer printed boards. This standard is intended as a basis on which agreements between purchaser and vendor can be made.
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